Products Products
Embedded Fanless PC (B series)
项目名称: B26D
担保机构: 还款方式: ♦ Fanless heatsink structure♦ Al alloy chassics, compact features,flexbile installation♦ Support WIFI/3G moudle,provide a board SIM expansion slot♦ 1*VGA/1*HDMI♦ 2*RTL 8111E Gigabit ethernet port, support wake on LAN♦ I/O Interfaces:6xCOM,1xVGA,2xLan, 1xAduio, 6xUSB,1xHMDI
项目规模: 0 项目期限: 0 个月 年化收益:

♦Intel@Atom N2600/1.66G dual core CPU

♦Intel®3600 Graph

♦1*DDR3/1.5V/2GB memory.

 

项目名称: B26LC
担保机构: 还款方式: ♦ Fanless heatsink structure♦Al alloy chassics ,compact features ,flexible installation♦Support WIFI/3G moudle, provide a board SIM expansion slot♦ 1*VGA/1*HDMI♦ 2*Intel Gigabit ethernet port,support wake on LAN♦I/O Interfaces :1x power input ,6xCOM,  1xVGA,1xHMDI,2xLan,1xAduio, 6xUSB
项目规模: 0 项目期限: 0 个月 年化收益:

♦ Intel®N2600/1.66GHz dual core CPU

♦ 1*DDR3/1.5V/2GB memory

 

 

 

项目名称: B801T
担保机构: 还款方式: ♦ Fanless heatsink structure♦ AL alloy chassics, compact features,flexible installation♦ support WIFI/3G moudle,provide a board SIM expansion slot♦ 1*VGA/1*HDMI♦ 2个Intel Gigabit ethernet port,support wake on LAN♦ I/O interfaces :1x power input ,6xCOM,  1xVGA,1xHMDI,2xLan,1xAduio, 6xUSB
项目规模: 0 项目期限: 0 个月 年化收益:

♦Intel®1037U/1.8GHz dual core CPU

♦Inboard 4G memory...

 

 

 

项目名称: B85T
担保机构: 还款方式: ♦ Fanless heat sink structure♦ AI alloy chassis, compact structure, flexible installation♦ Supports WIFI and 3G network expansion,provides 1*SIM card slot♦ 1xVGA/1xHDMI♦ 2*Intel 82583V Gigabit Ethernet port ,supports Wake On LAN♦ Rich I/O:6xCOM,1xVGA,2xLan, 1xAduio, 6xUSB,1xHMDI
项目规模: 0 项目期限: 0 个月 年化收益:

♦ BAY Trail platform N2930 CPU

♦ Intel®HD Graphics

 

♦ Inboard 4G memory

 

Copyright ©2015 - 2019 123456
犀牛云提供企业云服务
Fallow us and share on  :