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HTPC33 Cloud Terminal Host (1037U / J1900)
项目名称: 1U250C
担保机构: 还款方式: ♦ 1U standard chassis♦ High quality galvanized steel plate,compact structure,flexible installation♦ IntegratedIntel®D525/1.8GHz dual core processor♦ 1xVGA ,2xUSB2.0,1xCOM♦ Adapt RTL 8111E chipset,support 4* Gigabit
项目规模: 0 项目期限: 0 个月 年化收益:

 ♦ Intel®D525/1.8GHz dual core CPU

♦ Intel®G3150 Graphics

 

♦ 1*DDR3/1.5V/2GB memory

 

项目名称: 1UD52SL
担保机构: 还款方式: ♦ 1U280 standard chassis♦ High quality galvanized steel plate, compact structure, flexible installation♦ Adopt Atom/Bay Trail series processor♦ 1xVGA ,2xUSB2.0,1xCOM♦ Adopt Intel 82583V chipset,support 6* Gigabit Ethernet♦ Dimension:430mm*280mm*44.5mm
项目规模: 0 项目期限: 0 个月 年化收益:

♦ 1U280 standard chassis

♦ High quality galvanized steel plate, compact structure, flexible installation

♦ Adopt Atom/Bay Trail series processor

♦ 1xVGA ,2xUSB2.0,1xCOM

♦ Adopt Intel 82583V chipset,support 6* Gigabit Ethernet

♦ Dimension:430mm*280mm*44.5mm

 

 

项目名称: 1U280D
担保机构: 还款方式: ♦ 1U standard chassis♦ High quality galvanized steel plate,compact structure,flexible installation♦ Adopt Atom/1037U series processor♦ 1xVGA ,2xUSB2.0,1xCOM♦ Adopt Intel 82583V chipset,support 6* Gigabit Ethernet♦ Dimension:430mm*280mm*44.5mm
项目规模: 0 项目期限: 0 个月 年化收益:

♦ 1U standard chassis

♦ High quality galvanized steel plate,compact structure,flexible installation

♦ Adopt Atom/1037U series processor

♦ 1xVGA ,2xUSB2.0,1xCOM

♦ Adopt Intel 82583V chipset,support 6* Gigabit Ethernet

♦ Dimension:430mm*280mm*44.5mm

 

项目名称: 1U280A
担保机构: 还款方式: ♦ 1U standard chassis♦ High quality galvanized steel plate,compact structure,flexible installation♦ Adopt LGA771/LGA1155 series processor♦ 1xVGA ,2xUSB2.0,1xCOM♦ Adopt Intel 82574L chipset,support 6* Gigabit Ethernet♦ Dimension:430mm*280mm*44.5mm
项目规模: 0 项目期限: 0 个月 年化收益:

♦ 1U standard chassis

♦ High quality galvanized steel plate,compact structure,flexible installation

♦ Adopt LGA771/LGA1155 series processor

♦ 1xVGA ,2xUSB2.0,1xCOM

♦ Adopt Intel 82574L chipset,support 6* Gigabit Ethernet

♦ Dimension:430mm*280mm*44.5mm

 

项目名称: B26D
担保机构: 还款方式: ♦ Fanless heatsink structure♦ Al alloy chassics, compact features,flexbile installation♦ Support WIFI/3G moudle,provide a board SIM expansion slot♦ 1*VGA/1*HDMI♦ 2*RTL 8111E Gigabit ethernet port, support wake on LAN♦ I/O Interfaces:6xCOM,1xVGA,2xLan, 1xAduio, 6xUSB,1xHMDI
项目规模: 0 项目期限: 0 个月 年化收益:

♦Intel@Atom N2600/1.66G dual core CPU

♦Intel®3600 Graph

♦1*DDR3/1.5V/2GB memory.

 

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